Cirrus-logic CS4953xx Manuel d'utilisateur télécharger pdf (Page 11)

CS4953xx Data Sheet

32-bit Audio Decoder DSP Family

DS705F2 11

5.5 Thermal Data (144-pin LQFP)

5.6 Thermal Data (128-pin LQFP)

Notes: 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20 %

of the top & bottom layers.

2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-ounce copper covering

20 % of the top & bottom layers and 0.5-ounce copper covering 90 % of the internal power plane and ground plane

layers.

3. To calculate the die temperature for a given power dissipation

= Ambient Temperature + [ (Power Dissipation in Watts) * θ

]

4. To calculate the case temperature for a given power dissipation

= Τ

- [ (Power Dissipation in Watts) * ψ

]

Parameter Symbol Min Typ Max Unit

Thermal Resistance (Junction to Ambient)

Two-layer Board

Four-layer Board

—

°C / Watt

Thermal Resistance (Junction to Top of Package)

Two-layer Board

Four-layer Board

—

.39

.33

—

°C / Watt

Parameter Symbol Min Typ Max Unit

Thermal Resistance (Junction to Ambient)

Two-layer Board

Four-layer Board

—

°C / Watt

Thermal Resistance (Junction to Top of Package)

Two-layer Board

Four-layer Board

—

.45

.39

—

°C / Watt

1 2 ... 6 7 8 9 10 11 12 13 14 15 16 ... 36 37

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Cirrus-logic CS4953xx Manuel d'utilisateur Page 11

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