Cirrus-logic CS4350 Manuel d'utilisateur télécharger pdf (Page 37)

DS691F2 37

CS4350

11 PACKAGE DIMENSIONS

1. D” and “E1” are reference datums and do not include mold flash or protrusions, but do include mold

mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per

side.

2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be

0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-

duce dimension “b” by more than 0.07 mm at least material condition.

3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.

12 THERMAL CHARACTERISTICS

INCHES MILLIMETERS NOTE

DIM MIN NOM MAX MIN NOM MAX

A -- -- 0.043 -- -- 1.10

A1 0.002 0.004 0.006 0.05 -- 0.15

A2 0.03346 0.0354 0.037 0.85 0.90 0.95

b 0.00748 0.0096 0.012 0.19 0.245 0.30 2,3

D 0.303 0.307 0.311 7.70 7.80 7.90 1

E 0.248 0.2519 0.256 6.30 6.40 6.50

E1 0.169 0.1732 0.177 4.30 4.40 4.50 1

e -- 0.026 BSC -- -- 0.65 BSC --

L 0.020 0.024 0.028 0.50 0.60 0.70

0° 4° 8° 0° 4° 8°

JEDEC #: MO-153

Controlling Dimension is Millimeters.

Table 16. Thermal Characteristics

Parameters Symbol Min Typ Max Units

Package Thermal Resistance Single-Layer PCB

Multiple-Layer PCB



105

-°C/Watt

24L TSSOP (4.4 mm BODY) PACKAGE DRAWING

SEATING

PLANE

SIDE VIEW

END VIEW

TOP VIEW

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Cirrus-logic CS4350 Manuel d'utilisateur Page 37